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Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Nama merek:	XHS/ Customized
Nomor Model:	Kebiasaan
Moq:	10
Harga:	80-100USD
Ketentuan Pembayaran:	T/t
Kemampuan Penyediaan:	10000-100000pcs / minggu

Informasi Rinci

Deskripsi produk

Informasi Rinci

Tempat asal:

CINA

Sertifikasi:

ISO 9001, ISO 14001

Bahan:

Stainless steel, titanium atau disesuaikan

Ketebalan:

0.5-3.0mm

Toleransi:

+/- 0,005mm

Proses produksi:

Foto Etsa Kimia, Pelapisan, Stamping, Pemotongan Laser

Kemasan rincian:

Tas dan karton PE / disesuaikan

Menyediakan kemampuan:

10000-100000pcs / minggu

Menyoroti:

semi-etched plates for PCHE

complex manifolding heat exchanger plates

printed circuit heat exchanger plates

Deskripsi produk

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Description of Semi-Etched Plates for Printed Circuit Heat Exchangers

What is Printed Circiut Heat Exchangers?

Printed Circuit Board Heat Exchanger (PCHE), also known as Diffusion Bonded Compact Heat Exchanger, represents a new generation of heat exchange equipment combining ultra-compact design with high efficiency. This device utilizes chemical etching technology to precisely fabricate micrometer-to-millimeter-scale flow channels within metal plates. These plates are then integrated into a monolithic module through diffusion bonding, delivering both exceptional resistance to high temperatures and pressures alongside highly efficient heat transfer characteristics.

Specifications of Semi-Etched Plates for Printed Circuit Heat Exchangers

Material	Stainless Steel 316L, Titanium Aluminum, etc.
Thickness	0.05mm to 3.0mm can be customized
Size	Can be customized, Max to 700*1800mm,
General Tolerance	±0.1mm, according to the thickness of the plate
Processing	Photochemical machining/ metal etching/ Photo etching
Other Processing	Diffusion bonding or other processing as requested

Manufacturing of Semi-Etched Plates for Printed Circuit Heat Exchangers

1.Chemical etching micro channels of compact heat exchanger plates

2. Diffusion bonded compact heat exchangers plates

We excel in providing comprehensive PCHE solutions, leveraging precision chemical etching and advanced diffusion bonding to deliver heat exchangers of exceptional reliability, efficiency, and consistent performance—even under the most demanding conditions.

Packing and Shipping of Semi-Etched Plates for Printed Circuit Heat Exchangers

Packing Methods:

We offer multiple packaging options to ensure maximum protection, including protective covers, PE bags, and foam inserts. Customized packaging solutions are also available upon request.

Shipment Methods:

By Air / Sea/ Express: EMS/DHL/FedEx/UPS etc,

How to custom Compact Heat Exchanger Plates from us?

Please send us your design.
We accept the following file formats:DWG, DXF, PDF, STP, Gerber, IGES, CorelDraw and Adobe Illustrator
Samples making lead time:3-10days
Express:By DHL, FedEx, TNT, around 3-7days.

Tag:

Pemrosesan Kimia Foto

Penggoresan kimia logam

Layanan Metal Etching

Penggoresan Logam Presisi

Etsa Foto Baja Tahan Karat

Etsa titanium

Plat Bipolar Logam

Jaring Foto Etch

Disk Encoder Optik

Perisai EMI PCB

mengukir nikel

Aluminium etching

Etasi kimia tembaga

ukiran pita ke pita

pche penukar panas

Kamar Uap Ultra Ringan

Pemrosesan Kimia Foto

Penggoresan kimia logam

Layanan Metal Etching

Penggoresan Logam Presisi

Etsa Foto Baja Tahan Karat

Etsa titanium

Plat Bipolar Logam

Jaring Foto Etch

Disk Encoder Optik

Perisai EMI PCB

mengukir nikel

Aluminium etching

Etasi kimia tembaga

ukiran pita ke pita

pche penukar panas

Kamar Uap Ultra Ringan

rincian produk

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

Semi-Etched Plates for Complex Manifolding in Printed Circuit Heat Exchangers

semi-etched plates for PCHE

complex manifolding heat exchanger plates

printed circuit heat exchanger plates